J-STD-033D: The Standard for Moisture/Reflow and Process Sensitive Devices - Free Download

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Aug 1, 2023
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J-STD-033D: A Guide to Handling, Packing, Shipping, and Use of Moisture, Reflow, and Process Sensitive Devices

Introduction

If you are working with electronic components, especially surface-mount devices (SMDs), you need to be aware of the risks of moisture absorption and exposure to high temperatures during solder reflow. Moisture can cause internal damage to the devices, such as cracks, delamination, popcorning, or wire bond failures. These defects can reduce the performance, reliability, and lifespan of the devices.

To avoid these problems, you need to follow the standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive devices. These methods are provided by the joint standard IPC/JEDEC J-STD-033D, which was developed by the JEDEC JC-14.1 Committee on Reliability Test Methods for Packaged Devices and the B-10a Plastic Chip Carrier Cracking Task Group of IPC.

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What is J-STD-033D?

J-STD-033D is the latest revision of the joint standard for handling, packing, shipping, and use of moisture/reflow sensitive devices. It was published in April 2018 and supersedes the previous versions J-STD-033C-1 (August 2014), J-STD-033C (February 2012), J-STD-033B.1 (January 2007), J-STD-033B (October 2005), J-STD-033A (July 2002), J-STD-033 (April 1999), JEDEC JEP124, IPC-SM-786A (January 1995), and IPC-SM-786 (December 1990) .

J-STD-033D provides manufacturers and users with the following information:

The classification of moisture/reflow sensitivity levels for nonhermetic solid state surface mount devices.

The handling precautions for moisture/reflow sensitive devices prior to board assembly.

The packing materials and methods for moisture/reflow sensitive devices.

The shelf life and storage conditions for moisture barrier bags.

The drying methods and times for moisture/reflow sensitive devices after exposure to factory ambient.

The baking precautions and limitations for moisture/reflow sensitive devices.

The reflow profiles and conditions for moisture/reflow sensitive devices.

The identification of moisture/reflow sensitivity levels by labels or symbols.

Why is J-STD-033D important?

J-STD-033D is important because it helps to ensure the quality and reliability of electronic products that use surface-mount devices. By following the standard, you can avoid moisture-induced damage during reflow soldering, which can cause product failures or malfunctions. You can also save time and money by reducing rework, scrap, warranty claims, and customer complaints.

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J-STD-033D is also important because it is widely recognized and accepted by the electronics industry as the authoritative source of guidance for handling, packing, shipping, and use of moisture/reflow sensitive devices. It is compatible with other relevant standards, such as IPC/JE at

4 weeks

4 weeks at

168 hours

168 hours at

72 hours

72 hours at

48 hours

48 hours at

24 hours

24 hours at

J-STD-020 and J-STD-075

J-STD-020 and J-STD-075 are the standards that specify the test methods for determining the moisture/reflow sensitivity classification of nonhermetic solid state surface mount devices. J-STD-020 applies to plastic encapsulated microcircuits (PEMs), such as integrated circuits (ICs), while J-STD-075 applies to discrete semiconductors, such as diodes, transistors, and thyristors.

The test methods involve exposing the devices to a controlled humidity and temperature environment for a predefined period of time, followed by a reflow soldering process with a specified temperature profile. The devices are then inspected for any signs of moisture-induced damage, such as cracks, delamination, popcorning, or wire bond failures. The devices are assigned an MSL based on the maximum exposure time that does not cause any damage.

MSL Labels and Symbols

J-STD-033D requires that the moisture/reflow sensitivity levels of the devices be identified by labels or symbols on the packaging materials. The labels or symbols must include the following information:

The MSL number or symbol.

The peak package body temperature (PPT) or reflow temperature (RT) in C.

The caution statement: "Caution - Moisture Sensitive Device. Follow IPC/JEDEC J-STD-033 Handling Guide".

The manufacturer's name or logo.

The date code or lot code.

The quantity of devices in the package.

The barcode or 2D matrix code (optional).

The labels or symbols must be legible, durable, and resistant to solvents and abrasion. They must also comply with the size, color, and format specifications given in J-STD-033D. The figure below shows some examples of MSL labels and symbols:

Handling and Storage of Moisture/Reflow Sensitive Devices

The next step in J-STD-033D is to handle and store the moisture/reflow sensitive devices properly before board assembly. This involves controlling the exposure time and floor life of the devices, as well as using appropriate packing materials and methods.

Exposure Time and Floor Life

The exposure time is the cumulative time that a device is exposed to factory ambient conditions after being removed from its original sealed package. The floor life is the maximum exposure time allowed for a device before it needs to be reflowed or baked. The exposure time and floor life depend on the MSL of the device, as shown in the table above.

To control the exposure time and floor life of the devices, J-STD-033D recommends the following practices:

Use a humidity indicator card (HIC) and a desiccant inside the moisture barrier bag (MBB) to monitor the humidity level of the package.

Use a seal indicator to verify that the MBB is properly sealed.

Record the date and time when the MBB is opened or sealed.

Use a dry cabinet or a dry room to store the opened MBBs or loose devices.

Use a tracking system to keep track of the exposure time and floor life of each device or batch.

Bake or reflow the devices before they exceed their floor life.

Dry Pack and Shelf Life

The dry pack is the process of packing the moisture/reflow sensitive devices in a moisture barrier bag (MB B) with a desiccant and a humidity indicator card (HIC). The dry pack is intended to protect the devices from moisture absorption during shipping and storage. The shelf life is the maximum time that a sealed MBB can be stored before it needs to be opened or resealed.

To perform the dry pack and ensure the shelf life of the devices, J-STD-033D recommends the following practices:

Use a moisture barrier bag (MBB) that meets the requirements of EIA 583, Type 1 or IPC/JEDEC J-STD-033D, Table 4-1.

Use a desiccant that meets the requirements of MIL-D-3464, Type I or II.

Use a humidity indicator card (HIC) that meets the requirements of IPC/JEDEC J-STD-033D, Table 4-2.

Place the devices, the desiccant, and the HIC inside the MBB and seal it with a heat sealer.

Label the MBB with the MSL information, the date code, and the seal date.

Store the sealed MBBs in a controlled environment with a temperature of <40C and a relative humidity of <90%.

Check the HIC periodically to ensure that the humidity level inside the MBB is below 10%.

Reseal or bake the MBBs if they are opened or damaged.

Drying and Baking of Moisture/Reflow Sensitive Devices

The drying and baking of moisture/reflow sensitive devices are processes that remove the moisture from the devices after they have been exposed to factory ambient conditions. The drying is done before reflow soldering, while the baking is done after reflow soldering. The drying and baking methods and times depend on the MSL and the package thickness of the devices.

Drying Methods and Times

The drying methods and times for moisture/reflow sensitive devices are specified in J-STD-033D, Table 5-1. The table shows the minimum drying times for different MSLs, package thicknesses, and drying temperatures. The drying methods include:

Dry cabinet: A cabinet that maintains a low humidity environment (<5% RH) by using a dehumidifier or a nitrogen purge.

Dry pack: The process of packing the devices in a moisture barrier bag (MBB) with a desiccant and a humidity indicator card (HIC).

Bake: The process of heating the devices in an oven at a specified temperature for a specified time.

The table below shows an excerpt of J-STD-033D, Table 5-1:

MSL

Package Thickness

Minimum Drying Time

Dry Cabinet

Dry Pack

Bake

4 hours at

24 hours with fresh desiccant

8 hours at 125C

8 hours at 72 hours with fresh desiccant

16 hours at 125C

16 hours at

96 hours with fresh desiccant

24 hours at 125C

24 hours at

120 hours with fresh desiccant

48 hours at 125C

Baking Precautions and Limitations

Baking is an effective way to remove moisture from the devices, but it also has some drawbacks and limitations. J-STD-033D provides some precautions and recommendations for baking, such as:

Avoid baking the devices more than once, as it can degrade the solderability and reliability of the devices.

Avoid baking the devices at temperatures higher than 125C, as it can cause oxidation, intermetallic growth, or thermal stress.

Avoid baking the devices in their original sealed MBBs, as it can damage the MBBs and the HICs.

Avoid baking the devices with labels or stickers attached, as they can peel off or leave residues.

Avoid baking the devices with tape and reel packaging, as it can warp or shrink the carrier tape.

Avoid baking the devices with lead-free terminations, as they can form tin whiskers.

Use a vacuum oven or a nitrogen purge oven to reduce oxidation.

Use a convection oven or an infrared oven to ensure uniform heating.

Use a temperature controller and a thermocouple to monitor the baking temperature.

Use a moisture-proof container or a new MBB to store the baked devices.

Use and Reflow of Moisture/Reflow Sensitive Devices

The final step in J-STD-033D is to use and reflow the moisture/reflow sensitive devices on the printed circuit boards (PCBs). This involves following the appropriate reflow profiles and conditions, as well as preventing and detecting any reflow damage.

Reflow Profiles and Conditions

The reflow profiles and conditions for moisture/reflow sensitive devices are specified in J-STD-020 (for plastic encapsulated microcircuits) or J-STD-075 (for discrete semiconductors) . The reflow profiles describe the temperature and time variations during the reflow soldering process. The reflow conditions include the peak package body temperature (PPT) or reflow temperature (RT), which is the maximum temperature that the device can withstand during reflow without damage.

J-STD-020 and J-STD-075 define four standard reflow profiles: Pb-free, SnPb eutectic, SnPb double sided, and SnPb single sided. The table below shows an excerpt of J-STD-020, Table 4-1:

Reflow Profile Feature

Pb-Free Assembly

SnPb Eutectic Assembly

Average Ramp-Up Rate (Tsmax to Tp)Maximum Ramp-Up Rate

Average Ramp-Up Rate (Tsmax to Tp)

Maximum Ramp-Up Rate

Preheat

Min Ts (s) = 60 sec, Max Ts (s) = 120 sec

Temperature Min (Tsmin)

150C

100C

Temperature Max (Tsmax)

200C

150C

Time maintained above Temperature (TL)

217C, tL = 60 - 150 sec

183C, tL = 60 - 150 sec

Peak/Classification Temperature (Tp)

260 +0/-5 C

240 +0/-5 C

The reflow profiles and conditions must be followed carefully to ensure a good solder joint and avoid thermal stress or damage to the devices. The reflow profiles and conditions must also be compatible with the PCB materials and the solder paste used.

Reflow Damage and Prevention

Reflow damage is the damage caused by moisture absorption and exposure to high temperatures during reflow soldering. Reflow damage can manifest as cracks, delamination, popcorning, or wire bond failures in the devices. Reflow damage can reduce the performance, reliability, and lifespan of the devices.

To prevent reflow damage, J-STD-033D recommends the following practices:

Classify the moisture/reflow sensitivity levels of the devices according to J-STD-020 or J-STD-075.

Handle and store the devices according to J-STD-033D requirements and procedures.

Dry or bake the devices before they exceed their floor life.

Use the appropriate reflow profiles and conditions according to J-STD-020 or J-STD-075.

Inspect the devices for any signs of reflow damage after reflow soldering.

Conclusion

In this article, we have explained what J-STD-033D is, why it is important, how to get it for free, and what are its main requirements and procedures for handling, packing, shipping, and use of moisture/reflow sensitive devices. We have also covered the topics of classification of moisture/reflow sensitivity levels, handling and storage of moisture/reflow sensitive devices, drying and baking of moisture/reflow sensitive devices, and use and reflow of moisture/reflow sensitive devices.

We hope that this article has helped you to understand J-STD-033D better and to apply it in your work with electronic components. By following J-STD-033D, you can ensure the quality and reliability of your products and avoid moisture-induced damage during reflow soldering.

Summary of Key Points

J-STD-033D is the joint standard for handling, packing, shipping, and use of moisture/reflow sensitive devices.

J-STD-033D provides standardized methods for classifying, handling, packing, storing, drying, baking, and reflowing moisture/reflow sensitive devices.J-STD-033D helps to avoid moisture-induced damage during reflow soldering, which can cause product failures or malfunctions.

J-STD-033D is compatible with other relevant standards, such as J-STD-020 and J-STD-075.

J-STD-033D can be downloaded for free from the JEDEC website.

FAQs

Here are some frequently asked questions and answers about J-STD-033D:

What is the difference between J-STD-033D and J-STD-020 or J-STD-075?

J-STD-033D is the standard for handling, packing, shipping, and use of moisture/reflow sensitive devices. J-STD-020 and J-STD-075 are the standards for determining the moisture/reflow sensitivity classification of nonhermetic solid state surface mount devices. J-STD-033D refers to J-STD-020 and J-STD-075 for the test methods and criteria for classifying the devices.

What are the benefits of using a dry cabinet or a dry room for storing moisture/reflow sensitive devices?

A dry cabinet or a dry room is a device or a facility that maintains a low humidity environment (<5% RH) by using a dehumidifier or a nitrogen purge. Using a dry cabinet or a dry room can extend the floor life of the devices, reduce the need for baking, and prevent oxidation or corrosion of the devices.

How can I check if a device has been damaged by moisture during reflow soldering?

You can check if a device has been damaged by moisture during reflow soldering by inspecting it visually or using an acoustic microscope. Visual inspection can reveal cracks, delamination, popcorning, or wire bond failures on the surface or the edges of the device. Acoustic microscopy can detect internal defects that are not visible to the naked eye.

How can I prevent tin whiskers from forming on lead-free terminations?

Tin whiskers are thin, hair-like protrusions of tin that can grow on lead-free terminations due to stress, temperature, humidity, or other factors. Tin whiskers can cause short circuits or electrical failures in electronic products. To prevent tin whiskers from forming on lead-free terminations, you can use a conformal coating, a nickel barrier layer, or an annealing process.

Where can I find more information about J-STD-033D?

You can find more information about J-STD-033D on the JEDEC website , where you can download the standard for free. You can also contact JEDEC or IPC for any questions or feedback about the standard.

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